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Supermicro Mission Critical Server Solutions
Supermicro New Zealand
Intel Xeon E5-2600 V3 (Haswell-EP) and DDR4
30 June 2014

The next generation of server Xeon processors for the mainstream performance market is expected to be released in September (Q3 2014). This release is a "Tock" in Intel's Tick-Tock release cycle, signaling a new micro-architectural change to Haswell for increased performance while using the same 22nm process technology (fabrication) already used by Ivy Bridge-EP released in September 2013.

Haswell-EP will support up to 18 cores in the flagship model (Xeon E5-2699 v3); that means up to 36 logical cores with Hyper Threading technology. It will also support newer and faster main memory with DDR4-2133 and a faster Quick Path Interconnect link of up to 9.6GT/s between the two processors on Dual Socket systems.

The new processor models will be marketed as "Intel Xeon E5-26xx v3" where xx are 2 digits that indicate different models ranging from 4 to 18 physical cores; note the v3 at the end of the model name is important as it is the only differentiating factor compared to the older generation of CPUs. As it is based on a different architecture it uses a new LGA2011-3 socket, making it incompatible with existing motherboard platforms.


DDR4 RAM is available now ahead of the scheduled public release of these processors. Although DDR4 memory will scale from 2133MT/s to 3200MT/s and possibly beyond, these Haswell processors will support up to DDR4-2133. Notable changes from DDR3 to DDR4 are as follows:

  • More pins: 284-pin DIMM modules (240-pin DDR2/3)
  • Lower power: 1.2V as opposed to 1.5V
  • Faster data rates: starts at 2133MT/s; can potentially scale to 4266
  • Denser contact pins: pins are spaced more closely (0.85mm instead of 1.0)
  • Height is increased slightly (31.25mm / 1.23” instead of 30.35mm / 1.2”) to make signal routing easier
  • Thickness is increased (to 1.2mm from 1.0) to accommodate more signal layers



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Information in this document is subject to change without notice.
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